Multi-lane optical-electrical device testing using automated testing equipment

ABSTRACT

A hybrid automated testing equipment (ATE) system can simultaneously test electrical and optical components of a device under test, such as an optical transceiver. The device under test can be a multilane optical transceiver that transmits different channels of data on different lanes. The hybrid ATE system can include one or more light sources and optical switches in an optical test lane selector to selectively test and calibrate each optical and electrical components of each lane of the device under test.

PRIORITY

This application is a continuation of U.S. patent application Ser. No.16/943,377 filed Jul. 30, 2020, which is incorporated by referenceherein in its entirety.

TECHNICAL FIELD

The present disclosure generally relates to circuit testing, and moreparticularly to optical-electrical device testing.

BACKGROUND

Modern high-speed integrated circuits (ICs) have complex architectures,with millions of components such as transistors that must operate inconcert to transmit data at multi-gigabit data rates required by moderncommunication networks. One of the critical steps of manufacturing suchdevices is the testing and calibration of the high-speed devices toensure the devices do not fail at a later point in time (afterintegration into a product). One issue with testing and calibration ofsuch high-speed devices stems from the modern design process, in whichdifferent components of the device are designed by different companiesas “off the shelf” components. To this end, automatic test equipment(ATE) can be implemented by the device engineers to efficiently testhigh-speed designs at the chip and wafer level. Generally, an ATE systemincludes one or more computer-controlled equipment or modules thatinterface with the device under test (DUT) to perform stress testing andanalyze individual components with minimal human interaction. CurrentATE systems that are configured for electronic or semiconductor devicesare not configured to provide rapid testing and calibration of somemodern hybrid high-speed devices, such as multi-lane gigabit opticaltransceivers that process multiple lanes of electrical data and light toachieve high data rates.

BRIEF DESCRIPTION OF THE DRAWINGS

The following description includes discussion of figures havingillustrations given by way of example of implementations of embodimentsof the disclosure. The drawings should be understood by way of example,and not by way of limitation. As used herein, references to one or more“embodiments” are to be understood as describing a particular feature,structure, or characteristic included in at least one implementation ofthe inventive subject matter. Thus, phrases such as “in one embodiment”or “in an alternate embodiment” appearing herein describe variousembodiments and implementations of the inventive subject matter, and donot necessarily all refer to the same embodiment. However, they are alsonot necessarily mutually exclusive. To easily identify the discussion ofany particular element or act, the most significant digit or digits in areference number refer to the figure (“FIG.”) number in which thatelement or act is first introduced.

FIG. 1 is a diagram showing an optical and electrical testing system forimplementing reconfigurable multi-lane hybrid testing of photonicdevices, according to some example embodiments.

FIG. 2 is a block diagram illustrating an optical transceiver fortransmitting and receiving optical signals, according to some exampleembodiments.

FIG. 3 is an illustration of an optical-electrical device including oneor more photonic structures, according to some example embodiments.

FIG. 4 displays an optical-electrical ATE architecture, according tosome example embodiments.

FIG. 5 shows an example multilane optical test lane controllerarchitecture, according to some example embodiments.

FIG. 6A is a diagram showing a perspective view of an opticalinterconnect interface, according to some example embodiments.

FIG. 6B is a diagram showing the side cut-away view of the opticalinterconnect interface, according to some example embodiments.

FIG. 7 shows a flow diagram of a method for a multilane hybrid ATEtesting of an optical-electrical device under test, according to someexample embodiments.

Descriptions of certain details and implementations follow, including adescription of the figures, which may depict some or all of theembodiments described below, as well as discussing other potentialembodiments or implementations of the inventive concepts presentedherein. An overview of embodiments of the disclosure is provided below,followed by a more detailed description with reference to the drawings.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide an understanding ofvarious embodiments of the inventive subject matter. It will be evident,however, to those skilled in the art, that embodiments of the inventivesubject matter may be practiced without these specific details. Ingeneral, well-known instruction instances, structures, and techniquesare not necessarily shown in detail.

Modern ATE systems are not configured to rapidly test, validate, andcalibrate modern hybrid high-speed devices, such as multi-lane opticaltransceivers (e.g., 400 G (gigabits per second) optical transceiver),which include both complex electrical and optical modules. To this end,a hybrid optical-electrical ATE system can be implemented that uses oneor more electrical interfaces to interface with electrical test devicesof the ATE system and one or more optical interfaces (e.g., fibers,lens, gratings) to interface with optical test devices of the ATEsystem. In some example embodiments, the hybrid optical-electrical ATEsystem is implemented by augmenting an electrical ATE system anoff-the-shelf electrical ATE system) with an optical test assembly tointerface one or more testing devices (e.g., an optical spectrumanalyzer, an optical power meter) with an optical-electrical deviceunder test (DUT). The optical test assembly can include a socket withphysical alignment features that align with alignment features of anoptical interconnection head. The optical interconnection head can beimplemented as a ferrule adapter that interconnects one or more fibersfrom the optical devices (e.g., test modules, light sources) with theoptical-electrical DUT. In some example embodiments, theoptical-electrical DUT is electrically connected to the electrical ATEsystem using an electrical interface of the electrical ATE system, whilethe optical connections are input via the optical interconnection headto the opposite side of the optical-electrical DUT (e.g., a bottom-sideof the optical-electrical DUT in a flip-chip configuration, where thetop-side rests on the test bench and electrical interconnections of theATE electrical interface).

To perform hybrid testing, the optical-electrical ATE system can includean external broadband light source that injects light into one or moresingle mode fibers to the receive interface of the optical-electricalDUT. Each of the single mode fibers that input light into theoptical-electrical DUT corresponds to individual lane of a multi-laneoptical transceiver DUT having a plurality of lanes or channels (e.g.,four 100 G lanes for a combined 400 G data rate). The optical-electricalDUT can include multiple receiver/transmitter pairs for each lane, eachpair receive light to transmit (e.g., from the external light source),modulate the received light, and transmit the modulated light todifferent network destinations using a common output interface of theoptical-electrical DUT (e.g., four output ports or fibers).

In operation, the optical-electrical DUT can operate all four lanessimultaneously, thereby achieving high speed data rates. However, toefficiently test and calibrate the multi-lane DUT, in some exampleembodiments, the hybrid optical-electrical ATM system tests each laneindividually by inputting light into the lane-under-test and selectingoutput light from the lane-under-test to a testing device using anoptical switch (e.g., a 1×4 optical switch, a mechanical switch, anthermo-optic switch, a Mach-Zehnder Interferometer based switch). Forexample, the optical-electrical ATE system uses the broadband lightsource to generate light for the first input fiber lane, which the firstlane components of the optical-electrical DUT modulate and output on thefirst output fiber, where all of the output fibers from the DUT arecoupled to the optical switch. The optical switch selector is configuredto couple the first output fiber to a testing fiber (e.g., single modefiber) that is coupled to the optical testing devices. After thecomponents of the first lane are calibrated, the second input fiber canreceive light (e.g., from the broad band light source) for modulation,and output the modulated light to the optical switch. The optical switchreceives the modulated light for the second lane and couples the lightto the test fiber for testing by the one or more optical test devicesfor testing, analysis and calibration. In this way, each lane of theoptical-electrical DUT can undergo simultaneous electrical and opticalcalibration using electrical ATE test devices and optical test devicesin an efficient approach.

FIG. 1 shows an optical and electrical testing system 100 forimplementing reconfigurable multi-lane hybrid testing ofoptical-electrical devices, according to some example embodiments. Asillustrated, a handler 105 (e.g., integrated circuit (IC) handler, chiphander) is a robotic system that can precisely move anoptical-electrical device under test (DUT) 120 into position forsimultaneous optical and electrical testing and calibration. A workpress110 (e.g., a workpress assembly) is attached to the handler 105 to movethe DUT 120 to the test socket base 125. The workpress 110 can attach tothe DUT 120 using different means, such as a mechanical gripping device,a socket, or vacuum suction, according to some example embodiments.

The test socket base 125 is further positioned on an optical testassembly 130, which provides optical testing of the DUT 120 using one ormore optical analysis modules (e.g., an optical spectrum analyzer,optical power meter), and an electrical automated test equipment (ATE)145, which provides electrical automated testing using one or moreelectrical analyzer modules. The DUT 120 is electrically connected viaelectrical connections 135 (e.g., high speed test socket base 125) tothe optical test assembly and the ATE 145. Furthermore, the DUT 120 caninterface optically with the optical test assembly using one or moreoptical connections 140. For example, the optical connections 140 can beimplemented as optical paths that extend from the optical test assembly130 into the workpress 110, and back towards the topside of the DUT 120(e.g., which can be a top side, or “bottom side” in a flip chipconfiguration where the “top side” faces towards an interposer or hostboard). The ATE 145 can be an “off the shelf” ATE unit that is designedonly for electrical DUT testing. By implementing the optical testassembly and the optical connections 140, the testing ability of the ATEunit is augmented with optical analysis capabilities that enableefficient and accurate simultaneous electrical and optical testing ofDUTs. Further functional components and details of the optical testassembly are discussed in further detail below.

FIG. 2 is a block diagram illustrating an optical transceiver 200 fortransmitting and receiving optical signals, according to some exampleembodiments. The optical transceiver 200 is an example hybridoptical-electrical device that can undergo simultaneous multi-laneselectable testing and calibration (e.g., DUT 120, FIG. 1). Asillustrated, the optical transceiver 200 can be implemented to interfaceelectrical data from electrical devices, such as electrical hardwaredevice 250, convert the electrical data into optical data, and send andreceive the optical data with one or more optical devices, such asoptical device 275. For explanatory purposes, in the followingdescription the electrical hardware device 250 is a host board that“hosts” the optical transceiver 200 as a pluggable device that sends andreceives data to an optical switch network; where, for example, opticaldevice 275 can be other components of an optical switch network (e.g.,external transmitter 277). However, it is appreciated that the opticaltransceiver 200 can be implemented to interface with other types ofelectrical devices and optical devices. For instance, the opticaltransceiver 200 can be implemented as a single chip on a hybrid.“motherboard.” that uses an optical network (e.g., waveguides, fibers)as an optical bus to interconnect on-board electrical chips that processthe data after it is converted from light into binary electrical data,according to some example embodiments.

In some example embodiments, the hardware device 250 includes anelectrical interface for receiving and mating with an electricalinterface of the optical transceiver 200. The optical transceiver 200may be a removable front-end module that may be physically received byand removed from hardware device 250 operating as a backend modulewithin a communication system or device. The optical transceiver 200 andthe hardware device 250, for example, can be components of an opticalcommunication device or system (e.g., a network device) such as awavelength-division multiplexing (WDM) system that can implementdifferent types of multi-lane optical communication formats (e.g.,parallel-single fiber (PSM), formats defined by IEEE 802.3, including,for example: 400 GBASE-FR4, 40 GBASE-LR4, 40 GBASE-ER4).

The data transmitter 205 of the optical transceiver 200 can receive theelectrical signals, which are then converted into optical signals viaPIC 210. The PIC 210 can then output the optical signals via opticallinks, such as fiber or waveguides that interface with the PIC 210. Theoutput light data can then be processed by other components (e.g.;switches, endpoint servers, other embedded chips of on a single embeddedsystem), via a network such as a wide area network (WAN), optical switchnetwork, optical waveguide network in an embedded system, and others.

The optical transceiver 200 can receive high data rate optical signalsvia one or more optical links to optical device 275. The optical signalsare converted by the PIC 210 from light into electrical signals forfurther processing by data receiver 215, such as demodulating the datainto a lower data rate for output to other devices, such as theelectrical hardware device 250. The modulation used by the opticaltransceiver 200 can include pulse amplitude modulation (e.g., PAM4),quadrature phase-shift keying (QPSK), binary phase-shift keying (BPSK),polarization-multiplexed BPSK, M-ary quadrature amplitude modulation(M-QAM), and others.

FIG. 3 is an illustration of an optical-electrical device 300 (e.g.,optical transceiver) including one or more optical devices according toan embodiment of the disclosure. The optical-electrical device 300 is anexample of an optical transceiver 200 configured as a multi-chipstructure. In this embodiment, the optical-electrical device 300includes printed circuit board (PCB) 305, organic substrate 360, ASIC315, and photonic integrated circuit (PIC) 320. In this embodiment, thePIC 320 may include one or more optical structures described above. Insome example embodiments, the PIC 620 includes silicon on insulator(SOI) or silicon-based (e.g., silicon nitride (SiN)) devices, or maycomprise devices formed from both silicon and a non-silicon material.Said non-silicon material (alternatively referred to as “heterogeneousmaterial”) may comprise one of III-V material, magneto-optic material,or crystal substrate material. III-V semiconductors have elements thatare found in group III and group V of the periodic table (e.g., IndiumGallium Arsenide Phosphide (InGaAsP), Gallium Indium Arsenide Nitride(GainAsN)). The carrier dispersion effects of III-V-based materials maybe significantly higher than in silicon-based materials, as electronspeed in III-V semiconductors is much faster than that in silicon. Inaddition. III-V materials have a direct bandgap which enables efficientcreation of light from electrical pumping. Thus, III-V semiconductormaterials enable photonic operations with an increased efficiency oversilicon for both generating light and modulating the refractive index oflight. Thus, III-V semiconductor materials enable photonic operationwith an increased efficiency at generating light from electricity andconverting light back into electricity.

The low optical loss and high quality oxides of silicon are thuscombined with the electro-optic efficiency of III-V semiconductors inthe heterogeneous optical devices described below; in embodiments of thedisclosure, said heterogeneous devices utilize low loss heterogeneousoptical waveguide transitions between the devices' heterogeneous andsilicon-only waveguides.

Magneto-optic materials allow heterogeneous PICs to operate based on themagneto-optic (MO) effect. Such devices may utilize the Faraday Effect,in which the magnetic field associated with an electrical signalmodulates an optical beam, offering high bandwidth modulation, androtates the electric field of the optical mode enabling opticalisolators. Said magneto-optic materials may comprise, for example,materials such as iron, cobalt, or yttrium iron garnet (YIG). Further,in some example embodiments, crystal substrate materials provideheterogeneous PICs with a high electro-mechanical coupling, linearelectro optic coefficient, low transmission loss, and stable physicaland chemical properties. Said crystal substrate materials may comprise,for example, lithium niobate (LiNbO3) or lithium tantalite (LiTaO3).

In the example illustrated, the PIC 320 exchanges light with fiber 330via prism 325; said prism 325 is a misalignment-tolerant device used tocouple an optical mode to one or more single-mode optical fiber (e.g.,four transmit fibers, four receive fibers), according to some exampleembodiments. In other example embodiments, multiple fibers areimplemented to receive light from the prism 325 for various opticalmodulation formats.

In some example embodiments, the optical devices of PIC 320 arecontrolled, at least in part, by control circuitry included in ASIC 315.Both ASIC 315 and PIC 320 are shown to be disposed on copper pillars314, which are used for communicatively coupling the ICs via organicsubstrate 360. PCB 305 is coupled to organic substrate 360 via ball gridarray (BOA) interconnect 316, and may be used to interconnect theorganic substrate 360 (and thus, ASIC 315 and PIC 320) to othercomponents of optical-electrical device 300 not shown—e.g.,interconnection modules, power supplies, etc.

FIG. 4 displays an optical-electrical. ATE architecture 400, accordingto some example embodiments. The optical-electrical ATE architecture 400is an example implementation of the optical test assembly 130 foroptical testing and calibration of optical devices. At a high level, theATE 425 interfaces with the optical electrical device under test 405 anda hit error rate module 415 (e.g., an embedded BER tester). Further, andin accordance with some example embodiments, the ATE 425 can interfaceand display data from a compact OSA 430 that interfaces electricallywith the DUT 405 using a data interface (e.g., an RS-232 interface), andoptically via one or more fibers and an optical test lane controller. Insome example embodiments, the DUT 405 receives light from the pluralityof fibers 441 (e.g., one of four light injection fibers), and generatesdifferent modulated light beams (e.g., at different wavelengths, or ondifferent channels) that output onto one or more of the plurality offibers 441 (e.g., one or more of the output fibers 530A-530D). In thoseexample embodiments, the optical test lane controller is operable toselect one of the available plurality of fibers for output to opticaltesting devices, such as the OSA 430.

FIG. 5 shows an example optical test lane controller architecture 500(e.g., optical test lane controller 435), according to some exampleembodiments. In some example embodiments, the optical test lanecontroller architecture 500 comprises an optical switch 503, a lightsource 505, and an optical test device 513, which can be integrated intothe optical test assembly 130 according to some example embodiments. Insome example embodiments, the optical switch 503, the light source 505,and the optical test device 513 are external modules that are connectedto the optical test assembly via optical and electrical connections,such as electrical cables and fibers.

In the example illustrated, the optical test assembly 130 is connectedwith the switch 507 and the light source 505 using electricalconnections, such as switch control path 510, power path 515 and lasercontrol path 520. The switch control path 510 is operable to controlwhich lane of the optical switch 503 is selected for coupling to atesting fiber 535 which is coupled to the optical test device 513. Insome example embodiments, the optical switch 503 is implemented as amechanical switch that selects one of the fibers 530A-530D for couplinginto the testing fiber 535 using mechanical switches (e.g., MEMS opticalswitch) or non-mechanical switches, such as one or more couplers (e.g.,MZI) that select one of the fibers 530A-530D for output to testing fiber535.

In some example embodiments, the light source 505 comprises a pluralityof external lasers, where each laser is configured to generate light forone of the fibers 525A-525D. In other example embodiments, the lightsource 505 comprises a broadband tunable light source that can be tunedfor different wavelengths and power characteristics to generate lightfor any of the fibers 525A-525D.

The light generated by light source 505 is input into the DUT 120 (notdepicted) using the plurality of input fibers 525A-525D. In some exampleembodiments, the plurality of output fibers 530A-530D and the pluralityof input fibers 525A-525D are grouped together as the opticalconnections 140 which are input to the DUT 120 using an opticalinterconnect assembly, discussed in further detail below with referenceto FIG. 6A and FIG. 6B.

To perform simultaneous hybrid testing and calibration of the DUT 120,the optical test lane controller architecture 500 activates one lane ata time, sequentially. For example, in a first configuration, the opticaltest assembly 130 uses switch control path 510 to configure the opticalswitch 503 to couple the output fiber 530A to the testing fiber 535.Further, the optical test assembly 130 uses the laser control path 522to activate light source 505 for the first lane to transmits light intothe device under test using the input fiber 525A for the first lane.While in the first configuration, electrical components can be testedusing ATE 145, while the optical test assembly 130 uses the optical testdevice 513 to test and calibrate components of the first lane. Forexample, the light source 505 generates a first laser light which isinjected into the DUT using input fiber 525A. The data transmitter andoptical modulators for the first lane then modulate the received lightaccording to a modulation format (e.g., PAM4) and the modulated late isthen output by the device under test onto the output fiber 530A. Theoptical switch 503 then couples the modulated light from the fiber 530Ato the testing fiber 535 for analysis and calibration of components ofthe first lane (e.g., heater settings of the data transmitter for thefirst lane, modulator bias settings for an optical modulator for thefirst lane, etc.). Further details of hybrid testing and calibration ofthe device under test using an optical-electrical ATE system arediscussed in application Ser. No. 16/907,857, titled “OpticalTransceiver Loopback Eye Scans,” filed on Jun. 22, 2020; and applicationSer. No. 16/887,668, titled “Optical-Electrical Device Testing UsingHybrid Automated Testing Equipment,” filed on May 29, 2020, which arehereby incorporated by reference in their entirety.

After the first lane of the device under test is calibrated, the opticaltest lane controller architecture 500 can switch into a differentconfiguration to test the other lanes. For example, the optical testlane controller architecture 500 can configure the light source 505 togenerate light on the second lane 525B and configure the switch tocouple light from the output fiber 530B to the testing fiber 535 fortesting and calibrating using electrical and optical test devices.Similarly, additional lanes can be tested by using the optical test lanecontroller architecture 500 to sequentially activate the light source505 to generate onto one of the input fibers 525A-525D to inject lightinto the DUT and configure the optical switch 503 to couple modulatedlight received one of the output fibers 530A-530D onto the testing fiber535 for testing and calibration.

FIG. 6A shows a perspective view of an optical interconnect interface600, according to some example embodiments. The optical interconnectinterface 600 is operable to input and output light into the DUT 120from the optical connections 140 (e.g., eight single mode fibers). Insome example embodiments, the optical interconnect interface 600comprises an optical interconnection head. 605 (e.g., plug, socket,ferrule) that attaches to an optical interconnection receptacle 610. Thereceptacle 610 can be attached to the DUT 120 to couple light into theDUT 120. The optical interconnection head 605 and the opticalinterconnection receptacle 610 have corresponding alignment features 615that interlock. In some example embodiments, the optical interconnectionhead 605 is attached to the workpress 110. The workpress 110 is actuatedinto position by the handler 105 such that the alignment features 615align and interlock in a passive alignment process. That is, forexample, by aligning the optical interconnection head 605 to the opticalinterconnection receptacle 610 using the alignment features 615, theoutput fibers 530A-530D in the optical connections 140 are aligned withoutput gratings of the DUT 120 (e.g., that generator modulated light),and the input fibers 525A-530A in the optical connections 140 arealigned with input gratings of the DUT 120 (e.g., to inject light fromthe light source 505 into the device under test).

FIG. 6B shows the optical interconnect interface 600 from a side viewthat illustrates one or more internal components of the opticalinterconnect interface 600, according to some example embodiments. Inthe example of FIG. 6B, the optical interconnection head 605 has beeninterlocked with the optical interconnection receptacle 610 such thatlight from the optical connections 140 can be coupled to the DUT 120. Inthe example illustrated, the optical connections within the opticalinterconnection head 605 are each single mode fibers 653 that transmitlight which reflects off a lens 650 towards a beam path 665 (e.g. aninternal waveguide, a fiber) The beam path 665 transmits the lighttowards a one or more lenses 655 (e.g. a micro-lens array) which directsthe light towards a grating 660 of the DUT 120.

FIG. 7 shows a flow diagram of a method 700 for a multilane hybrid ATEtesting of an optical-electrical device under test, according to someexample embodiments. At operation 705, the optical test assembly 130 isconfigured to perform optical testing of the first lane of the deviceunder test. For example, the optical test assembly 130 configures thelight source 505 to generate light for the first lane and furtherconfigures the optical switch 503 to couple light from output fiber 530Ato the testing fiber 535.

At operation 710, a light source inputs light for the first lane intothe device under test. For example, the first lane light from the lightsource 505 is injected into the device under test using the opticalinterconnect interface 600 which has been passively aligned usingalignment features as discussed above. In some example embodiments, thelight source is integrated in the device under test and operation 710 isomitted. For example, a light source within the DUT 120 is activated togenerate light for testing (e.g., modulation, analysis).

At operation 715, first modulated light from the first lane is received.For example, the first modulated light is received from the DUT 120 viathe optical interconnect interface onto the output fiber 530A which isinput into the optical switch 503 which is configured to transmit thelight to the optical test device 513 via the testing fiber 535.

At operation 720, the optical test assembly 130 calibrates first lanecomponents of the device under test (e.g., calibrates optical modulatorsof the first lane using optical test devices, calibrates electricalheaters of the first lane according to one or more electrical testdevices).

At operation 725, the optical test assembly 130 configures the next laneof the device under test for hybrid optical and electrical testing. Forexample, at operation 725, the optical test assembly 130 configures theoptical switch 503 to couple output fiber 530B to the testing fiber 535and further configures the light source 505 to generate light on theinput fiber 52B for injection into the second lane components of thedevice under test.

At operation 730, light from the light source for the additional Lane(e.g. second lane) is input into the device under test. For example,light propagating on fiber 525A is input into the DUT 120 using theoptical interconnect interface 600 that is passively aligned. Atoperation 735, the additional modulated light from the additional laneis received. For example, a second lane of modulated light is receivedvia the optical interconnect interface 600 which outputs the light onoutput fiber 530B and into the testing device via the optical switch 503and the testing fiber 535. In some example embodiments, operation 720may be omitted from method 700 (e.g., the DUT 120 includes embeddedlight sources for the different lanes).

At operation 740, while in the second configuration, one or moreelectrical or optical components used to modulate light of the secondlane are tested and calibrated and calibration settings are storedon-device (e.g., in microcontroller memory of the DUT). In some exampleembodiments, the method 700 loops for additional lanes of the multilaneDUT 120 (e.g., a third lane, a fourth lane).

The following are example embodiments:

Example 1. A method for testing of an optical-electrical device undertest (DUT) using an automated testing equipment (ATE) system, the methodcomprising: configuring an optical test lane switch selector in a firstconfiguration for optical testing of a first lane of theoptical-electrical DUT, the optical-electrical DUT being a multilaneoptical transceiver comprising a plurality of transceiver lanesincluding the first lane and a second lane, each lane of the pluralityof transceiver lanes modulating light using an optical transmitter forthe lane and receiving light using an optical receiver for the lane, theoptical test lane switch selector being configured for the firstconfiguration by selecting, using an optical switch in the optical test,lane switch selector, one of a plurality of output, fibers coupled tothe optical-electrical DUT to a testing fiber that is coupled to anoptical testing device, the optical test lane switch selector beingfurther configured in the first configuration by activating an externallight source in the optical test lane switch selector to transmit lightto the optical-electrical DUT on one of a plurality of input fibers thatare coupled to the optical-electrical DUT the one of the plurality ofoutput fibers and the one of the plurality of input fibers correspondingto the first lane of the multilane optical transceiver; calibrating oneor more optical components of the first lane of the optical-electricalDUT while the optical test lane switch selector is in the firstconfiguration, the one or more optical components calibrated accordingto data generated by the optical testing device using the light coupledinto the testing fiber by the optical switch in the first configuration;configuring the optical test lane switch selector in a secondconfiguration for optical testing of a second lane of theoptical-electrical DUT, wherein the second lane is another lane of theplurality of transceiver lanes, the optical test lane switch selectorbeing configured for the second configuration by selecting, using theoptical switch in the optical test lane switch selector, another of theplurality of output fibers coupled to the optical-electrical DUT to thetesting fiber that is coupled to the optical testing device, the opticaltest lane switch selector being further configured in the secondconfiguration by activating the external light source of the opticaltest lane switch selector to transmit light to the optical-electricalDUT on another of the plurality of input fibers that are coupled to theoptical-electrical DUT, the another of the plurality of output fibersand the another of the plurality of input fibers corresponding to thesecond lane of the multilane optical transceiver; and calibrating one ormore optical components of the second lane of the optical-electrical DUTwhile the optical test lane switch selector is in the secondconfiguration, the one or more optical components calibrated accordingto additional data generated by the optical testing device using thelight that is coupled to the testing fiber by the optical test laneswitch selector in the second configuration.

Example 2. The method of example 1, wherein the external light sourcecomprises a plurality of light sources, and wherein in the firstconfiguration a first light source of the plurality of light sourcesgenerates a first light for the first lane, and wherein in the secondconfiguration a second light source of the plurality of light sourcesgenerates a second light for the second lane.

Example 3. The method of example 1 or 2, wherein the external lightsource comprises a broadband light source that is tunable to differentwavelengths, the broadband light source generating light for first lanewhile in the first configuration, the broadband light source generatinglight for the second lane while in the second configuration.

Example 4. The method of any of examples 1-3, wherein the optical switchis a mechanical switch that is reconfigurable to select one of aplurality of fibers coupled to a plurality of input ports of the opticalswitch to an output port of the optical switch.

Example 5. The method of any of examples 1-4, further comprising:configuring the optical test lane switch selector in a thirdconfiguration for optical testing of a third lane of theoptical-electrical DUT, wherein the third lane is another lane of theplurality of transceiver lanes, the optical test lane switch selectorbeen configured for the third configuration by selecting, using theoptical switch, one of the other of the plurality of output fiberscoupled to the optical-electrical DUT to the testing fiber that iscoupled to the optical testing device, the optical test lane switchselector being further configured in the third configuration byactivating the external light source to transmit light to one of theother of the plurality of the input fibers are coupled to theoptical-electrical DUT, the one of the other of the plurality of outputfibers in the one of the other of the plurality of input fiberscorresponding to a third lane of the optical-electrical DUT.

Example 6. The method of any of examples 1-5, further comprising:calibrating one or more optical components of the third lane of theoptical-electrical DUT while the optical test lane switch selector is inthe third configuration, the one or more optical components calibratedaccording to further data generated by the optical testing device usingthe light is coupled into the testing fiber by the optical test laneswitch selector in the third configuration.

Example 7. The method of any of examples 1-6, wherein the plurality ofoutput fibers in the plurality of input fibers are coupled to theoptical-electrical DUT using an optical interconnect structurecomprising alignment features that align optical output and input pathsof the optical-electrical DUT with each of the plurality of outputfibers in the plurality of input fibers.

Example 8. The method of any of examples 1-7, wherein the opticalinterconnect structure comprises one or more lenses that direct thelight from the plurality of output fibers in the plurality of inputfibers to the optical-electrical DUT.

Example 9. The method of any of examples 1-8, wherein the opticalinterconnect structure comprises a socket affixed to theoptical-electrical DUT, the socket comprising additional alignmentfeatures that interlock with the alignment features.

Example 10. The method of any of examples 1-9, wherein the socketcomprises a grating coupler to propagate light from the opticalinterconnect structure coupled from the plurality of output fibers orthe plurality of input fibers.

Example 11. The method of any of examples 1-10, wherein the ATE systemcomprises one or more electronic testing modules for testing electricalcomponents of the optical-electrical DUT.

Example 12. The method of any of examples 1-11, further comprising:calibrating, while the optical test lane switch selector is in the firstconfiguration, a first set of electrical components of the first lane ofthe multilane optical transceiver while the optical testing devicecalibrates the one or more optical components of the first lane of theoptical-electrical DUT.

Example 13. The method of any of examples 1-12, further comprising:calibrating, while the optical test lane switch selector is in thesecond configuration, a second set of electrical components of thesecond lane of the optical-electrical DUT while the optical test devicegenerates calibration data for the one or more optical components of thesecond lane of the optical-electrical DUT.

Example 14. The method of any of examples 1-13, wherein the opticaltesting device is an optical spectrum analyzer.

Example 15. The method of any of examples 1-14, wherein the opticaltesting device is an optical power meter.

Example 16. An automated testing equipment (ATE) system for testing ofan optical-electrical device under test (DUT), the ATE systemcomprising: an optical testing device to generate calibration data usinglight received from a testing fiber that is coupled to theoptical-electrical DUT; and an optical test lane switch selector that,in a first configuration, tests a first lane of the optical-electricalDUT, the optical-electrical DUT being a multilane optical transceivercomprising a plurality of transceiver lanes including the first lane anda second lane, each lane of the plurality of transceiver lanesmodulating light using an optical transmitter for the lane and receivinglight using an optical receiver for the lane, the optical test laneswitch selector being configured for the first configuration byselecting, using an optical switch in the optical test lane switchselector, one of a plurality of output fibers coupled to theoptical-electrical DUT to a testing fiber that is coupled to an opticaltesting device, the optical test lane switch selector being furtherconfigured in the first configuration by activating an external lightsource in the optical test lane switch selector to transmit light to theoptical-electrical DUT on one of a plurality of input fibers that arecoupled to the optical-electrical DUT the one of the plurality of outputfibers and the one of the plurality of input fibers corresponding to thefirst lane of the multilane optical transceiver, wherein the opticaltest lane switch selector, in a second configuration, tests a secondlane of the optical-electrical DUT, wherein the second lane is anotherlane of the plurality of transceiver lanes, the optical test lane switchselector being configured for the second configuration by selecting,using the optical switch in the optical test lane switch selector,another of the plurality of output fibers coupled to theoptical-electrical DUT to the testing fiber that is coupled to theoptical testing device, the optical test lane switch selector beingfurther configured in the second configuration by activating theexternal light source of the optical test lane switch selector totransmit light to the optical-electrical DUT on another of the pluralityof input fibers that are coupled to the optical-electrical DUT, theanother of the plurality of output fibers and the another of theplurality of input fibers corresponding to the second lane of themultilane optical transceiver.

Example 17. The ATE system of example 16, wherein the external lightsource comprises a plurality of light sources, and wherein in the firstconfiguration a first light source of the plurality of light sourcesgenerates a first light for the first lane, and wherein in the secondconfiguration a second light source of the plurality of light sourcesgenerates a second light for the second lane.

Example 18. The ATE system of any of examples 16 or 17, wherein theoptical switch is a mechanical switch that is reconfigurable to selectone of a plurality of fibers coupled to a plurality of input ports ofthe optical switch to an output port of the optical switch.

Example 19. The ATE system of any of examples 16-18, wherein theplurality of output fibers in the plurality of input fibers are coupledto the optical-electrical. DUT using an optical interconnect structurecomprising alignment features that align optical output and input pathsof the optical-electrical DUT with each of the plurality of outputfibers in the plurality of input fibers.

Example 20. The ATE system of any of examples 16-19, wherein the opticaltesting device is an optical spectrum analyzer.

In the foregoing detailed description, the method and apparatus of thepresent inventive subject matter have been described with reference tospecific exemplary embodiments thereof. It will, however, be evidentthat various modifications and changes may be made thereto withoutdeparting from the broader spirit and scope of the present inventivesubject matter. The present specification and figures are accordingly tobe regarded as illustrative rather than restrictive.

What is claimed is:
 1. A method comprising: actuating, using a handlerof an automated testing system, an optical-electrical device to connectto an electric testing module of the automated testing system and toconnect to an optical testing module of the automated testing system,the optical-electrical device connected to the electric testing moduleof the automated testing system using electrical connections while theoptical-electrical device is connected to the optical testing module ofthe automated testing system using optical connections: configuring anoptical test lane switch selector in a first configuration for opticaltesting of a first lane of the optical-electrical device; calibratingone or more optical components of the first lane of theoptical-electrical device using the optical testing module while theoptical test lane switch selector is in the first configuration andwhile one or more electrical components of the optical-electrical deviceare electrically connected to the electrical testing module; configuringthe optical test lane switch selector in a second configuration foroptical testing of a second lane of the optical-electrical device; andcalibrating one or more other optical components of the second lane ofthe optical-electrical device using the optical testing module while theoptical test lane switch selector is in the second configuration andwhile the one or more electrical components of the optical-electricaldevice are electrically connected to the electrical testing module. 2.The method of claim 1, further comprising: generating a first light anda second light using an external light source that comprises a pluralityof light sources, wherein in the first configuration a first lightsource of the plurality of light sources generates the first light forthe first lane, and wherein in the second configuration a second lightsource of the plurality of light sources generates the second light forthe second lane.
 3. The method of claim 1, further comprising:generating a first light and a second light using an external lightsource that comprises a plurality of light sources, wherein the externallight source comprises a broadband light source that is tunable todifferent wavelengths, the broadband light source generating the firstlight for the first lane while in the first configuration, the broadbandlight source generating the second light for the second lane while inthe second configuration.
 4. The method of claim 1, wherein the opticaltest lane switch selector comprises an optical switch to switch lanes.5. The method of claim 1, further comprising: configuring the opticaltest lane switch selector in a third configuration for optical testingof a third lane of the optical-electrical device, wherein the third laneis another lane of a plurality of transceiver lanes of theoptical-electrical device, the optical test lane switch selector beenconfigured for the third configuration by selecting, using the opticaltest lane switch selector, one of a set of output fibers coupled to theoptical-electrical device to a testing fiber that is coupled to opticaltesting module, the optical test lane switch selector being furtherconfigured in the third configuration by activating an external lightsource to transmit light to one or more input fibers of the opticalconnections that are coupled to the optical-electrical device.
 6. Themethod of claim 5, further comprising: calibrating one or moreadditional optical components of the third lane of theoptical-electrical device while the optical test lane switch selector isin the third configuration, the one or more optical componentscalibrated according to further data generated by the optical testingmodule using light that is coupled into the testing fiber by the opticaltest lane switch selector in the third configuration.
 7. The method ofclaim 1, wherein the optical connections comprises input fibers thatinput light into the optical-electrical device and output fibers thatreceive light returned from the optical-electrical device, wherein theoptical connections further comprise one or more lenses that direct thelight from the output fibers and the input fibers to theoptical-electrical device.
 8. The method of claim 1, wherein the opticalconnections comprise an optical socket affixed to the optical-electricaldevice, the optical socket comprising additional alignment features thatinterlock with physical interlocking features.
 9. The method of claim 8,wherein the optical socket comprises a grating coupler to propagatelight with input fibers and output fibers of the optical connections.10. The method of claim 1, further comprising: calibrating, while theoptical test lane switch selector is in the first configuration, a firstset of electrical components of the first lane of the optical-electricaldevice while the optical testing module calibrates the one or moreoptical components of the first lane of the optical-electrical device.11. The method of claim 10, further comprising: calibrating, while theoptical test lane switch selector is in the second configuration, asecond set of electrical components of the second lane of theoptical-electrical device while the optical testing module generatescalibration data for the one or more optical components of the secondlane of the optical-electrical device.
 12. The method of claim 1,wherein the optical testing module is an optical spectrum analyzer. 13.The method of claim 1, wherein the optical testing module is an opticalpower meter.
 14. An automated testing system for testing of anoptical-electrical device, the automated testing system comprising. ahandler to actuate the optical-electrical device to connect to anelectric testing module of the automated testing system and connect toan optical testing module of the automated testing system, theoptical-electrical device connected to the electric testing module ofthe automated testing system using electrical connections while theoptical-electrical device is connected to the optical testing module ofthe automated testing system using optical connections; and an opticaltest lane switch selector that is configurable in a first configurationfor optical testing of a first lane of the optical-electrical device andconfigurable in a second configuration for optical testing of a secondlane of the optical-electrical device, wherein in the firstconfiguration one or more optical components of the first lane of theoptical-electrical device are calibrated using the optical testingmodule while one or more electrical components of the optical-electricaldevice are electrically connected to the electrical testing module,wherein in the second configuration one or more other optical componentsof the second lane of the optical-electrical device are calibrated usingthe optical testing module while the one or more electrical componentsof the optical-electrical device are electrically connected to theelectrical testing module.
 15. The automated testing system of claim 14,wherein an external light source that comprises a plurality of lightsources generates a first light and a second light, wherein in the firstconfiguration a first light source of the plurality of light sourcesgenerates the first light for the first lane, and wherein in the secondconfiguration a second light source of the plurality of light sourcesgenerates the second light for the second lane.
 16. The automatedtesting system of claim 14, wherein an external light source thatcomprises a plurality of light sources generates a first light and asecond light, wherein the external light source comprises a broadbandlight source that is tunable to different wavelengths, the broadbandlight source generating the first light for the first lane while in thefirst configuration, the broadband light source generating the secondlight for the second lane while in the second configuration.
 17. Theautomated testing system of claim 14, wherein while the optical testlane switch selector is in the first configuration, a first set ofelectrical components of the first lane of the optical-electrical deviceare calibrated while the optical testing module calibrates the one ormore optical components of the first lane of the optical-electricaldevice.
 18. The automated testing system of claim 14, wherein while theoptical test lane switch selector is in the second configuration, asecond set of electrical components of the second lane of theoptical-electrical device are calibrated while the optical testingmodule generates calibration data for the one or more optical componentsof the second lane of the optical-electrical device.
 19. The automatedtesting system of claim 14, wherein the optical testing module is anoptical spectrum analyzer.
 20. The automated testing system of claim 14,wherein the optical testing module is an optical power meter.